EUV Metal Oxide Resist Development Technology for Improved Sensitivity, Roughness and Pattern Collapse Margin for High Volume Manufacturing-Reference-Cited by-同舟云学术

EUV Metal Oxide Resist Development Technology for Improved Sensitivity, Roughness and Pattern Collapse Margin for High Volume Manufacturing

Published:2022-12-16 Issue:1 Volume:35 Page:87-93
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Dinh Cong Que¹,Nagahara Seiji²,Kuwahara Yuhei¹,Dauendorffer Arnaud¹,Yoshida Keisuke¹,Okada Soichiro¹,Onitsuka Tomoya¹,Kawakami Shinichiro¹,Shimura Satoru¹,Muramatsu Makoto¹,Yoshihara Kosuke¹,Petersen John S.³,Simone Danilo De³,Foubert Philippe³,Vandenberghe Geert³,Huli Lior⁴,Grzeskowiak Steven⁴,Krawicz Alexandra⁴,Bae Nayoung⁴,Kato Kanzo⁴,Nafus Kathleen⁵,Raley Angélique⁵

Affiliation:

1. Tokyo Electron Kyushu Ltd.

2. Tokyo Electron Ltd.

3. imec

4. TEL Technology Center, America, LLC.

5. Tokyo Electron America, Inc.

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/35/1/35_87/_pdf

Reference20 articles.

1. 1. R. Brainard, C. Higgins, E. Hassanein, R. Matyi, and A. Wüest, J. Photopolym. Sci. Technol., 21 (2008) 457.

2. 2. T. I. Wallow, R. Kim, B. LaFontaine, P. P. Naulleau, C. N. Anderson, and R. L. Sandberg, Proc. SPIE, 6533 (2007) 653317.

3. 3. R. Gronheid, T. R. Younkin, M. J. Leeson, C. Fonseca, J. S. Hooge, K. Nafus, J. J. Biafore, and M. D. Smith, J. Micro/Nanolithogr. MEMS MOEMS, 10 (2011) 033004.

4. 4. T. Kozawa and S. Tagawa, Jpn. J. Appl. Phys., 49 (2010) 030001.

5. 5. C. A. Mack, Proc. SPIE, 7639 (2010) 763931.

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel EUV Underlayer Design for Metal Oxide Resist Patterning;Journal of Photopolymer Science and Technology;2024-06-25

2. Advanced Development Techniques for Extreme-Tight Pitch Patterning;Journal of Photopolymer Science and Technology;2024-06-25

3. Application of higher absorption materials to the underlayer of EUV lithography;Advances in Patterning Materials and Processes XLI;2024-04-09

4. Advanced processes in metal-oxide resists for high-NA EUV lithography;Advances in Patterning Materials and Processes XLI;2024-04-09

5. Advanced development for contact-holes of metal-oxide resists;International Conference on Extreme Ultraviolet Lithography 2023;2023-11-21