Determining the Effects of Slurry Surfactant, Abrasive Size, and Abrasive Content on the Tribology and Kinetics of Copper CMP

Author:

Li Z.,Ina K.,Lefevre P.,Koshiyama I.,Philipossian A.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. K. Cheemalapati, A. Chowdhury, V. Duvvuru, and Y. Li , inProceedings of the CMP-MIC, Marina Del Rey, CA (2004).

2. F. Sun, R. Zhou, M. Kason, and R. Martinez , inProceedings of the CMP-MIC, Marina Del Rey, CA (2004).

3. Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization

4. Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

5. Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP

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