Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP-Reference-Cited by-同舟云学术

Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP

Published:2004 Issue:7 Volume:151 Page:G482
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Li Z.,Borucki L.,Koshiyama I.,Philipossian A.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. J. Sorooshian, D. DeNardis, L. Charns, Z. Li, D. Boning, F. Shadman, and A. Philipossian, inProceedings of the 2003 CMP-MIC, p. 43-50 (2003).

2. P. Renteln and T. Ninh,Mater. Res. Soc. Symp. Proc.,566, 155 (1999).

3. R Cowan and W. Winer, inASM Handbook, Friction, Lubrication and Wear Technology, vol. 18, P. J. Blau, Editor, pp. 39-44, ASM International Materials Park, OH (1992).

4. Z. Li, S. Rader, P. Lefevre, K. Ina, and A. Philipossian, Paper 899 presented at The Electrochemical Society Meeting, Orlando, FL, Oct 12-17, 2003.

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