Effect of Surfactant as Additive in Wet Clean Solutions on Properties of Low-k Materials

Author:

Le Q. T.,Jeannot V.,Baklanov M. R.,Vanderheyden R.,Boullart W.,Vanhaelemeersch S.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference11 articles.

1. Post-Plasma-Etch Residue Removal Using CO[sub 2]-Based Fluids

2. Post Plasma Etch Residue Removal Using CO[sub 2]-TMAHCO[sub 3] Mixtures: Comparison of Single-Phase and Two-Phase Mixtures

3. Design of Nonionic Surfactants for Supercritical Carbon Dioxide

4. Water-in-Carbon Dioxide Microemulsions: An Environment for Hydrophiles Including Proteins

5. M. R. Baklanov, Q. T. Le, E. Kesters, F. Iacopi, J. Van Aelst, H. Struyf, W. Boullart, S. Vanhaelemeersch, and K. Maex , IITC 2004 presentation, paper presented at International Information Technology Conference 2004.

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