Glass‐to‐Glass Bonding for Vacuum Packaging of Field Emission Display in an Ultra‐High‐Vacuum Chamber Using Silicon Thin Film-Reference-Cited by-同舟云学术

Glass‐to‐Glass Bonding for Vacuum Packaging of Field Emission Display in an Ultra‐High‐Vacuum Chamber Using Silicon Thin Film

Published:1999-01-01 Issue:1 Volume:146 Page:400-404
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Choi W. B.¹,Ju B. K.¹,Lee Y. H.¹,Jeong S. J.²,Lee N. Y.²,Sung M. Y.³,Oh M. H.¹

Affiliation:

1. Electronic Materials and Devices Research Center, Korea Institute of Science and Technology, Seoul 130-650, Korea

2. Information Display Research Institute, Orion Electric Company, Suwon, Korea

3. Department of Electrical Engineering, Korea University, Seoul, Korea

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1391621/pdf

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