Affiliation:
1. Waseda University
2. Tanaka Kikinzoku Kogyo K.K.
Publisher
Japan Institute of Electronics Packaging
Reference26 articles.
1. [1] Y.-T. Cheng, L. Lin, and K. Najafi, "A Hermetic Glass-Silicon Package Formed Using Localized Aluminum/Silicon-Glass Bonding," Journal of Microelectromechanical Systems, Vol. 10, No. 3, pp. 392-399, Sep. 2001.
2. [2] C. S. Tan, J. Fan, D. F. Lim, G. Y. Chong, and K. H. Li, "Low temperature wafer-level bonding for hermetic packaging of 3D microsystems," Journal of Micromechanics and Microengineering, Vol. 10, Issue 7, 075006, July 2011.
3. [3] K. Zoschke, C.-A. Manier, M. Wilke, N. Jurgensen, H. Oppermann, D. Ruffieux, J. Dekker, H. Heikkinen, S. Dalla Piazza, G. Allegato, and K.-D. Lang, "Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies," Proceedings of the 63rd Electronic Components and Technology Conference, pp. 1500-1507, 2013.
4. [4] S.-I. Yamamoto, E. Higurashi, T. Suga, R. Sawada, "Low-temperature hermetic packaging for microsystems using AuAu surface-activated bonding at atmospheric pressure," Journal of Micromechanics and Microengineering, Vol. 22, No. 5, 055026, May 2012.
5. [5] A. Tai, H. Karagozoglu, and K. L. Chuan, "Organic sealant materials for quasi-hermetic sealing of MEMS sensor packages," Proceedings of the 8th Electronics Packaging Technology Conference, pp. 462-471, 2006.
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