Post Plasma Etch Residue Removal in Dilute HF Solutions

Author:

Thanu D. P. R.,Raghavan S.,Keswani M.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Developments of Plasma Etching Technology for Fabricating Semiconductor Devices

2. Evaluation of Copper Oxide to Copper Selectivity of Chemical Systems for BEOL Cleaning Through Electrochemical Investigations

3. C. Timmons , Ph.D. Dissertation, Department of Chemical Engineering, Georgia Institute of Technology (2004).

4. R. J. Small, B. P. Patel, D. Holmes, J. Daviot, and C. Reid , U.S. Pat. 6,777,380 (2004).

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