Additive Behavior during Copper Electrodeposition in Solutions Containing Cl[sup −], PEG, and SPS-Reference-Cited by-同舟云学术

Additive Behavior during Copper Electrodeposition in Solutions Containing Cl[sup −], PEG, and SPS

Published:2003 Issue:6 Volume:150 Page:C420
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Tan Min,Harb John N.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference29 articles.

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4. J. Reid and S. Mayer, inAdvanced Metallization Conference 1999, p. 53, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Editors, MRS, Warrendale, PA (2000).

5. Superconformal Electrodeposition of Copper

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