Author:
West Alan C.,Mayer Steven,Reid Jonathan
Publisher
The Electrochemical Society
Subject
Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering
Reference18 articles.
1. Damascene copper electroplating for chip interconnections
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Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II
, P. C. Andricacos, P. C. Searson, C. Reidsema-Simposon, P. Allongue, J. L. Stickney, and G. M. Oleszek, Editors, PV 99-9, p. 52, The Electrochemical Society Proceedings Series, Pennington, NJ (1999).
3. Co-Deposition of Sulphur from Acid Copper Solution Containing Thiourea
4. Simulation of Leveling in Electrodeposition
5. Mass Transport of Leveling Agents in Plating: Steady‐State Model for Blocking Additives
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228 articles.
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