Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology
Author:
Affiliation:
1. Material and Measurement Laboratory, National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, Maryland 20899, United States
Publisher
American Chemical Society (ACS)
Subject
General Medicine,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.accounts.2c00840
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1. Superconformal film growth: Mechanism and quantification
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4. Editors' Choice—Simulation of Copper Electrodeposition in Through-Hole Vias
5. Damascene copper electroplating for chip interconnections
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