Author:
Nguyen Ngoc Duy,Wang Gang,Brammertz Guy,Leys Maarten,Waldron Niamh,Winderickx Gillis,Lismont Kevin,Dekoster J.,Loo Roger,Meuris Marc,Degroote Stefan,Buttitta Francesco,O'Neil Barry,Féron Olivier,Lindner Johannes,Schulte Frank,Schineller Bernd,Heuken Michael,Caymax Matty
Abstract
We have deposited III-V alloys on 200 mm Si miscut wafers with an oxide pattern. The selective epitaxial growth (SEG) of GaAs in large windows defined by SiO2 lines on a thick strained-relaxed Ge buffer layer served as a test vehicle which allowed us to demonstrate the integration of a III-V material deposition process step in a Si manufacturing line using an industrial reactor. High quality GaAs layers with high wafer-scale thickness uniformity were achieved. In a subsequent step, SEG of InP was successfully performed on wafers with a 300 nm shallow trench isolation pattern. The seed layer morphology depended on the treatment of the Ge surface and on the growth temperature. Such an approach for the integration of III-V materials on Si substrates allowed us to obtain extended-defect-free epitaxial regions suitable for the fabrication of high-performance devices.
Publisher
The Electrochemical Society
Cited by
10 articles.
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