Effective Strategy for Porous Organosilicate to Suppress Oxygen Ashing Damage

Author:

Liu Po-Tsun,Chang T. C.,Mor Y. S.,Chen C. W.,Tsai T. M.,Chu C. J.,Pan F. M.,Sze S. M.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference17 articles.

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3. The effects of plasma treatment for low dielectric constant hydrogen silsesquioxane (HSQ)

4. P. A. Kohl, Q. Zhao, K. Patel, D. Schmidt, S. A. Bidstrup-Allen, R. Shick, and S. Jayaraman, in Dielectric Materials Integration for Microelectronics , W. D. Brown, S. S. Ang, M. Loboda, B. Sammakia, R. Singh, and H. S. Rathore, Editors, PV 98-3, p. 169, The Electrochemical Society Proceedings Series, Pennington, NJ (1998).

5. Structure-Property Correlation in Low K Dielectric Materials

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