The effects of plasma treatment for low dielectric constant hydrogen silsesquioxane (HSQ)-Reference-Cited by-同舟云学术

The effects of plasma treatment for low dielectric constant hydrogen silsesquioxane (HSQ)

Published:1998-11 Issue:1-2 Volume:332 Page:345-350
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Liu P.T,Chang T.C,Sze S.M,Pan F.M,Mei Y.J,Wu W.F,Tsai M.S,Dai B.T,Chang C.Y,Shih F.Y,Huang H.D

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. N.P. Hacker, et al., SEMATECH Low Dielectric Constant Materials And Interconnects Workshop Proceedings, 1996, p. 233.

2. T. Ramos, A. Maskara, W. Ackerman, D.M. Smith, SEMATECH Low Dielectric Constant Materials and Interconnects Workshop Proceedings, 1996, p. 174.

3. T. Ramos, K. Roderick, A. Maskara, D.M. Smith, Materials Research Society Symposium Proceedings, Vol. 443, 1997, p. 91

4. B.T. Ahlburn, G.A. Brown, T.R. Seha, T.F. Zoes, Dielectrics for ULSI Multilevel Interconnection Conference, 1995, p. 36.

5. A. Nakashima, M. Egami, M. Komatsu, Y. Ohkura, M. Miyajima, H. Harada, S. Fukuyama, Dielectrics for ULSI Multilevel Interconnection Conference, 1997, p. 303.

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