Communication—Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/ab902c/pdf
Reference19 articles.
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3. Reevaluation of Hydrogen Gas Dissolved Cleaning Solutions in Single Wafer Megasonic Cleaning
4. Effect of Dissolved CO2 in De-Ionized Water in Reducing Wafer Damage During Megasonic Cleaning in MegPie
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