Investigation of Effect of L-Aspartic Acid and H2O2 for Cobalt Chemical Mechanical Polishing
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/ab8c1a/pdf
Reference29 articles.
1. Size-Dependent Resistivity in Nanoscale Interconnects
2. Resistivity of sub-30 nm copper lines
3. Amorphous Co-Ti alloy as a single layer barrier for Co local interconnect structure
4. Exploring alternative metals to Cu and W for interconnects: An ab initio insight
5. Tungsten and cobalt metallization: A material study for MOL local interconnects
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