Performance Evaluation of Cleaning Solutions Enhanced with Tetraalkylammonium Hydroxide Substituents for Post-CMP Cleaning on Poly-Si Film

Author:

Pan Tung Ming,Lei Tan Fu,Ko Fu Hsiang,Chao Tien Sheng,Liaw Ming Chi,Lee Ying Hao,Lu Chih Peng

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference17 articles.

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2. A. V. Ferris-Prabhu,Introduction to Semiconductor Device Yield Modeling, Chap. 1, Artech House, Boston, MA (1992).

3. G. Bai, C. Chiang, J. N. Cox, S. Fang, and D. S. Gardner, in Digest of Technical papers of the Symposium on VLSI Technology, 48 (1996).

4. D. Hymes, I. Malik, J. Zhang, and R. Emami, Solid State Technol., 209 (July 1997).

5. Chemical–mechanical polishing for giant magnetoresistance device integration

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