Analysis of The Etching Mechanisms of Tungsten in Fluorine Containing Plasmas-Reference-Cited by-同舟云学术

Analysis of The Etching Mechanisms of Tungsten in Fluorine Containing Plasmas

Published:1995-06-01 Issue:6 Volume:142 Page:1971-1976
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Verdonck Patrick¹²³⁴,Swart Jacobus¹²³⁴,Brasseur Guy¹²³⁴,De Geyter Pascal¹²³⁴

Affiliation:

1. LSI PEE EPUSP, Sao Paulo, Brazil

2. DSIF FEE UNICAMP, Campinas, Brazil

3. Cobrain N.V., 3001 Leuven, Belgium

4. IMEC v.z.w., 3001 Leuven, Belgium

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2044225/pdf

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