ILD CMP with Silica Abrasive Particles: Interfacial Removal Kinetics and Effect of Pad Surface Textures-Reference-Cited by-同舟云学术

ILD CMP with Silica Abrasive Particles: Interfacial Removal Kinetics and Effect of Pad Surface Textures

Published:2010 Issue:11 Volume:157 Page:H1061
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Li Shoutian,Gaudet Greg,Sun Fred,Naman Ananth

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference40 articles.

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2. Chemical Mechanical Planarization IV, R. L. Opila , C. Reidsema-Simpson , K. B. Sundaram , and S. Seal , Editors, PV 2000-26, p. 222, The Electrochemical Society Proceedings Series, Pennington, NJ (2001)

3. Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects

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