ILD CMP with Silica Abrasive Particles: Effect of Pore Size of CMP Pad on Removal Rate Profiles
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference56 articles.
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3. Investigation of pad deformation and conditioning during the CMP of silicon dioxide films
4. Optimization of tribological properties of silicon dioxide during the chemical mechanical planarization process
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