Engineering SiO<sub>2</sub> Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing
Author:
Affiliation:
1. Department of Energy Engineering, Hanyang University, Republic of Korea
2. Department of Electronic Engineering, Kyonggi University, Republic of Korea
3. School of Chemical Engineering, Yeungnam University, Republic of Korea
Publisher
Hosokawa Powder Technology Foundation
Subject
General Engineering,General Materials Science,General Chemical Engineering,General Chemistry
Link
https://www.jstage.jst.go.jp/article/kona/advpub/0/advpub_2025001/_pdf
Reference134 articles.
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2. Anderson A.M., Carroll M.K., Hydrophobic silica aerogels: review of synthesis, properties and applications, Aerogels Handbook, (2011) 47–77. https://doi.org/10.1007/978-1-4419-7589-8_3
3. Argekar S.U., Kirley T.L., Schaefer D.W., Determination of structure-property relationships for 3-aminopropyltriethoxysilane films using X-ray reflectivity, Journal of Materials Research, 28 (2013) 1118–1128. https://doi.org/10.1557/jmr.2013.54
4. Armini S., De Messemaeker J., Whelan C., Moinpour M., Maex K., Composite polymer core–ceria shell abrasive particles during oxide CMP: a defectivity study, Journal of the Electrochemical Society, 155 (2008) H653. https://doi.org/10.1149/1.2949085
5. Babchin A.J., Schramm L.L., Osmotic repulsion force due to adsorbed surfactants, Colloids and Surfaces B: Biointerfaces, 91 (2012) 137–143. https://doi.org/10.1016/j.colsurfb.2011.10.050
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