Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection-Reference-Cited by-同舟云学术

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Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection

Published:2012-01-01 Issue:1 Volume:1 Page:P7-P10
ISSN:2162-8742
Container-title:ECS Solid State Letters
language:en
Short-container-title:ECS Solid State Letters

Author:

Chen Z.,Luo T.,Hang T.,Li M.,Hu A.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Co micro-cone arrays with stable and uniform morphology for low-temperature solid-state bonding;Materials Today Communications;2023-12

2. Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding;Electronic Materials Letters;2023-09-25

3. Electrodeposited Ternary CuNiMo Catalysts for Alkaline Hydrogen Oxidation;Electronic Materials Letters;2023-09-10

4. Review on the electrodeposition and properties of high-density chip interconnection;SCIENTIA SINICA Chimica;2023-08-23

5. Study on Low-Temperature Bonding and Reliability of Nano-Twin Copper Micro-Cone Array;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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