Through-Hole Filling by Copper Electroplating Using a Single Organic Additive-Reference-Cited by-同舟云学术

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Through-Hole Filling by Copper Electroplating Using a Single Organic Additive

Published:2011 Issue:1 Volume:14 Page:D13
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Dow Wei-Ping,Liu De-Huei,Lu Chun-Wei,Chen Chien-Hung,Yan Jhih-Jyun,Huang Su-Mei

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference11 articles.

1. A novel copper electroplating formula for laser‐drilled micro via and through hole filling

2. Through-Hole Filling by Copper Electroplating

3. Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating

4. Fabrication of High Aspect Ratio 35 μm Pitch Through-Wafer Copper Interconnects by Electroplating for 3-D Wafer Stacking

5. Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Cited by 49 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system;Journal of Industrial and Engineering Chemistry;2024-07

2. Computational and experiments exploration of convection on Cu filling characteristics of multiple aspect-ratio micro through-holes;Electrochimica Acta;2022-06

3. Revealing the acceleration effect of SPS and Cl - on copper Surface: Instantaneous nucleation and Multi-Step energy change;Applied Surface Science;2022-05

4. Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias;Journal of The Electrochemical Society;2022-03-01

5. Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias;Journal of The Electrochemical Society;2022-01-01

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