Author:
Li Tomi T.,Chen H. T.,Yang Thomas C. K.,Yang S. W.,Liu H. H.,Chiang Leo
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Jang D. M. Ryu C. Lee K. Y. Cho B. H. , 57th Electronic Components and Technology Conference, p. 847 (2007).
2. High-Aspect-Ratio Copper-Via-Filling for Three-Dimensional Chip Stacking
3. Beica R. Sharbono C. Ritzdorf T. , Proc. Electronic Components and Technology Conference, p. 577 (2008).
4. Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD processes