Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD processes-Reference-Cited by-同舟云学术

Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD processes

Published:2008-10 Issue:10 Volume:85 Page:1947-1951
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Lühn O.,Van Hoof C.,Ruythooren W.,Celis J.-P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. E. Beyne, in: Proceedings of the IEEE International Interconnect Technology Conference, Burlingame, 4–7 June, 2006, pp. 1–5.

2. B. Swinnen, W. Ruythooren, P. De Moor, L. Bogaerts, L. Carbonell, K. De Munck, B. Eyckens, S. Stoukatch, D. Sabuncuoglu Tezcan, Z. Tokei, J. Vaes, J. Van Aelst, E. Beyne, in: Proceedings of the International Electron Devices Meeting (IEEE IEDM 2006), San Francisco, 11–13 December, 2006, pp. 1–4.

3. O. Lühn, C. Van Hoof, W. Ruythooren, J.-P. Celis, in: International Conference EURO-INTERFINISH, Nanotechnology and Innovative Coatings, Athens, 18–19 October, 2007, Abstract O 08.

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