Contact Behavior and Chemical Mechanical Polishing (CMP) Performance of Hole-Type Polishing Pad
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Kim Jiyoung Hong Angustin J. Ogawa Masaaki Ma Siguang Song Emil B. Lin You-Sheng Chung U-In Wang Kang L. , “Novel 3-D Structure for Ultra High Density Flash Memory with VRAT (Vertical-Recess-Array-Transistor) and PIPE (Planarized Integration on the same PlanE)”, 2008 Symposium on VLSI Technology Digest of Technical Paper, pp. 122–123 (2008).
2. Sub-50-nm Dual-Gate Thin-Film Transistors for Monolithic 3-D Flash
3. Van Olmen J. Coenen J. Dehaene W. Meyer K. De Huyghebaert C. Jourdain A. Katti Guruprasad Mercha A. Rakowski M. Stucchi M. Travaly Y. Beyne E. Swinnen B. , “3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer Bonding with copper Through Silicon Vias (TSV)”, IEEE Int. Conf. on 3D Sys. Integr. 1–5, Sep. 28–30, San Francisco, CA, USA (2009).
4. Yoon Seung Wook Yang Dae Wook Koo Jae Hoon Padmanathan Meenakshi Carson Flynn , “3D TSV Processes and its Assembly/Packaging Technology”, IEEE Int. Conf. on 3D Sys. Integr., 28–30, Sep. 28–30, San Francisco, CA, USA (2009).
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Analysis of the material removal mechanism in chemical mechanical polishing with in-situ macroscale nonwoven pad contact interface observation using an evanescent field;Precision Engineering;2023-07
2. A statistical characterization model of the microscale contact state of polishing pads;Journal of Physics: Conference Series;2023-07-01
3. Measurement of Contact Pressure Distribution Map at Workpiece/tin Lap Interface and Process Parameters Optimization During Full-Aperture Polishing With Tin Lap;ECS Journal of Solid State Science and Technology;2020-05-13
4. Effect of Non-Ionic Surfactant on Chemical Mechanical Planarization Performance in Alkaline Copper Slurry;International Journal of Precision Engineering and Manufacturing;2018-11
5. Influence of slurry components on copper CMP performance in alkaline slurry;Microelectronic Engineering;2017-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3