Author:
Kelly J. J.,Zheng M.,Deligianni H.,Baker-O’Neal B. C.,Cabral C.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Properties of Copper Layers Deposited by Electroplating on an Agglomerated Copper Seed Layer
2. M. Zheng, J. Kelly, and H. Deligianni , J. Electrochem. Soc., 154, D400(2007).
3. L. Chen and T. Ritzdorf , inElectrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II, P. C. Andricacos , P. C. Searson , C. Reidsema-Simpson , P. Allongue , J. L. Stickney , and G. M. Oleszek , Editors, PV 99-9, p. 122, The Electrochemical Society Proceedings Series, Pennington, NJ (2000).
4. Electrochemical nucleation
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献