Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2Substrate for All-Wet Metallization Process-Reference-Cited by-同舟云学术

Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2Substrate for All-Wet Metallization Process

Published:2014 Issue:14 Volume:161 Page:D756-D760
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Kim Kwang Hwan,Lim Taeho,Kim Myung Jun,Choe Seunghoe,Park Kyung Ju,Ahn Sang Hyun,Kwon Oh Joong,Kim Jae Jeong

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Electroless nickel plating from acid bath

2. Ultrasound influence on the activation step before electroless coating

3. Electrochemical Study of the Electroless Deposition of Co(P) and Co(W, P) Alloys

4. Formation of CoNi alloy thin films on silicon by electroless deposition

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