Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers-Reference-Cited by-同舟云学术

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Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers

Published:2017-05 Issue: Volume:405 Page:350-358
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Chen Sung-Te,Chung Yu-Cheng,Fang Jau-Shiung,Cheng Yi-Lung,Chen Giin-Shan

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference47 articles.

1. Advanced interconnects: materials, processing, and reliability;Baklanov;ECS J. Solid State Sci. Technol.,2015

2. Process technology for copper interconnects;Gambino,2012

3. Integrated electrochemical deposition of copper metallization for ultralarge-scale integrated circuits;Chang;J. Electrochem. Soc.,2004

4. Cu electroless deposition onto Ta substrates: application to create a seed layer for Cu electrodeposition;Lee;Electrochem. Solid-State Lett.,2006

5. Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent;Kim;Electrochim. Acta,2015

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films;Journal of Vacuum Science & Technology B;2023-07-01

2. Manufacture of complex pattern flexible copper microcircuits based on silver seeds through chemical growth welding;New Journal of Chemistry;2023

3. Electroless Metallization of the Elements: Survey and Progress;ACS Applied Electronic Materials;2022-12-07

4. Self-assembled monolayer-immobilized gold nanoparticles for WO3/TiO2 nanocomposite films to yield remarkably enhanced ultraviolet and visible-light photocatalytic activity;Materials Letters;2022-03

5. Effect of Surface Pretreatment and Plating Time on Electromagnetic Shielding Reliability of Electroless Plated Copper Layer Conductors;ACS Applied Electronic Materials;2022-03-01

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