Cu Electroless Deposition onto Ta Substrates-Reference-Cited by-同舟云学术

Cu Electroless Deposition onto Ta Substrates

Published:2006 Issue:10 Volume:9 Page:C157
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Lee Chang Hwa,Hwang Soonsik,Kim Sang-Chul,Kim Jae Jeong

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference19 articles.

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4. A Superfilling Model that Predicts Bump Formation

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