Electrolytic Chromate Films Prepared via Pulse Electrodeposition as a Cu-Epoxy Adhesion Promoter-Reference-Cited by-同舟云学术

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Electrolytic Chromate Films Prepared via Pulse Electrodeposition as a Cu-Epoxy Adhesion Promoter

Published:2020-01-29 Issue:2 Volume:167 Page:022512
ISSN:1945-7111
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Kwon Young Hwan,Park Da Jung,Lee Joo-Yul,Park Young-Bae,Choe Seunghoe,Lee Kyu Hwan

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1945-7111/ab6b12/pdf

Reference44 articles.

1. Effect of copper lamination on the rheological and copper adhesion properties of a thermotropic liquid crystalline polymer used in PCB applications

2. Synergistic effects of gelatin and convection on copper foil electrodeposition

3. Interactive Effects of Additives and Electrolyte Flow Rate on the Microstructure of Electrodeposited Copper Foils

4. High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS

5. Integrated electrochemical approach for the investigation of silane pre-treatments for painting copper

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