Funder
IEEC @ Binghamton University
NSF | MPS | Division of Chemistry (CHE)
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Lueck M. Malta D. Huffman A. Gregory C. Butler M. Lannon J. Temple D. S. , 2013 Ieee 63rd Electronic Components and Technology Conference (Ectc), 317 (2013).
2. Liu D. P. Park S. , Journal of Electronic Packaging, 136 (2014).
3. Sukumaran V. Chen Q. A. Liu F. H. Kumbhat N. Bandyopadhyay T. Chan H. T. Min S. Nopper C. Sundaram V. Tummala R. , Elec Comp C, 557 (2010).
4. Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献