The synergistic effects of additives on the micro vias copper filling
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering,Analytical Chemistry
Reference51 articles.
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4. Low-resistivity Cu film electrodeposited with 3-N, N-dimethylaminodithiocarbamoyl-1-propanesulfonate for the application to the interconnection of electronic devices;Cho;Thin Solid Films,2012
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1. Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits;IEEE Transactions on Microwave Theory and Techniques;2024-01
2. Unveiling the potential and mechanisms of 3,3′-bicarbazole-based quaternary ammonium salts as levelers;Electrochimica Acta;2023-12
3. Electrocrystallization and Morphology of Copper Coatings in the Presence of Organic Additives;Coatings;2023-11-05
4. Progress and prospects of super-filling in Damascene copper electroplating process;SCIENTIA SINICA Chimica;2023-09-01
5. Research progress of additives for electroplating copper in high-end electronic manufacturing;SCIENTIA SINICA Chimica;2023-09-01
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