Effect of interaction between dodecyltrimethylammonium chloride (DTAC) and bis(3-sulphopropyl) disulphide (SPS) on the morphology of electrodeposited copper-Reference-Cited by-同舟云学术

Effect of interaction between dodecyltrimethylammonium chloride (DTAC) and bis(3-sulphopropyl) disulphide (SPS) on the morphology of electrodeposited copper

Published:2013-09 Issue: Volume:106 Page:49-62
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Chrzanowska A.,Mroczka R.,Florek M.

Funder

European Union

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference24 articles.

1. Control of overfill bumps in damascene Cu electrodeposition;Kim;ECS Transactions,2007

2. Classification of suppressor additives based on synergistic and antagonistic ensemble effects;Broekmann;Electrochimica Acta,2011

3. Rapid galvanostatic determination on levelers for superfilling in Cu electroplating;Tsai;Electrochemical and Solid State Letters,2010

4. Effect of convection-dependent adsorption of additives on microvia filling in an acidic copper plating solution;Huang;Journal of the Electrochemical Society,2012

5. Enhancement of filling performance of a copper plating formula at low chloride concentration;Dow;Electrochimica Acta,2008

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