Author:
Shima Kohei,Shimizu Hideharu,Momose Takeshi,Shimogaki Yukihiro
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference63 articles.
1. The International Technology Roadmap for Semiconductors, Interconnect, 2012.
2. Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions
3. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
4. Edelstein D. Uzoh C. Cabral C. Jr. DeHaven P. Buchwalter P. Simon A. Cooney E. Malhotra S. Klaus D. Rathore H. Agarwala B. Nguyen D. , Proc. IEEE Int. Interconnect Technol. Conf., San Francisco (2001).
5. Electromigration path in Cu thin-film lines
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献