Analysis of Hydrogen Content in Plasma Silicon Nitride Film

Author:

Yoshimi Takeo1,Sakai Hideo1,Tanaka Keizo1

Affiliation:

1. Computer Development Laboratories, Limited, Kodaira, Tokyo, Japan

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

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2. Low-temperature-deposited insulating films of silicon nitride by reactive sputtering and plasma-enhanced CVD: Comparison of characteristics;Japanese Journal of Applied Physics;2016-03-16

3. Thermally stable ZrN/Zr3N4bilayered barrier system for through-Si-via process;Japanese Journal of Applied Physics;2015-04-17

4. Low-temperature Deposition of Reactively-sputtered SiNx Films Applicable to TSV Process;IEEJ Transactions on Electronics, Information and Systems;2015

5. Characterization;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22

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