Author:
Bozkaya Dinçer,Müftü Sinan
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Chemical Mechanical Planarization of Semiconductor Materials, M. R. Oliver , Editor, Springer, New York (2004).
2. A plasticity-based model of material removal in chemical-mechanical polishing (CMP)
3. A Physical Model for Dishing during Metal CMP
4. A. J. Clark, K. B. Witt, and R. L. Rhoades , inFourth CMP-MIC Conference, Institute of Microelectronics On-Chip Interconnection, Santa Clara, CA, pp. 401–404 (1999).
Cited by
41 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献