Author:
Ee Y. C.,Juneja Jasbir S.,Wang Pei-I,Lu T.-M.,Bakhru H.,Chan L.,Law S. B.,Yong Clare,Chen Z.,Xu S.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Copper Transport in Thermal SiO2
2. C. Chiang, S.-M. Tzeng, G. Raghavan, R. Villasol, G. Bai, M. Bohr, H. Fujimoto, and D. B. Fraser ,Proceedings of VLSI Multilevel Interconnect Conference, Santa Clara, CA, IEEE, pp. 414–420 (1994).
3. Kinetics of copper drift in PECVD dielectrics
4. Tantalum Nitride Films Grown by Inorganic Low Temperature Thermal Chemical Vapor Deposition Diffusion Barrier Properties in Copper Metallization
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献