Author:
Kato M.,Sato J.,Otani H.,Homma T.,Okinaka Y.,Osaka T.,Yoshioka O.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Substrate‐Catalyzed Electroless Gold Plating
2. Evaluation of Substrate (Ni)-Catalyzed Electroless Gold Plating Process
3. T. Inoue, S. Ando, H. Okudaira, J. Ushio, A. Tomizawa, H. Takehara, T. Shimazaki, H. Yamamoto, and H. Yokono, inProceedings of the 45th IEEE Electronic Components Technology Conference, p. 1095, IEEE, New York (1995).
4. M. Kato, Y. Yazawa, and Y. Okinaka, inProceedings of the AESF Technical Conference, SUR/FIN ’95, p. 805 (1995).
5. G. A. Krulik and N. V. Mandich, U.S. Pat. 5,232,492 (1992).
Cited by
38 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献