Stable non-cyanide electroless gold plating which is applicable to manufacturing of fine pattern printed wiring boards-Reference-Cited by-同舟云学术

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Stable non-cyanide electroless gold plating which is applicable to manufacturing of fine pattern printed wiring boards

Published: Issue: Volume: Page:
ISSN:
Container-title:1995 Proceedings. 45th Electronic Components and Technology Conference
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Author:

Inoue T.,Ando S.,Okudaira H.,Ushio J.,Tomizawa A.,Takehara H.,Shimazaki T.,Yamamoto H.,Yokono H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/3906/11336/00517822.pdf?arnumber=517822

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Newly Developed Non-Cyanide Electroless Gold Plating Method Using Thiomalic Acid as a Complexing Agent and 2-Aminoethanethiol as a Reducing Agent;CORROS SCI TECHNOL-K;2022

2. Investigation of Metal-Oxide Co-Electro/Electroless Deposition Method for Co-Ce-O Composite Films by Potential-pH Diagrams;ECS Electrochemistry Letters;2014-07-24

3. Directed self-assembly of nanorod networks: bringing the top down to the bottom up;Nanotechnology;2012-11-26

4. A novel surface activation method for Ni/Au electroless plating of acrylonitrile–butadiene–styrene;Surface and Coatings Technology;2011-12

5. Ion exchange adsorption and elution for recovering gold thiosulfate from leach solutions;Hydrometallurgy;2010-01

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