Author:
Tu Hung-En,Su Chun-Jen,Jeng U-Ser,Leu Jihperng
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Ingerly D. Agrawal A. Ascazubi R. Blattner A. Buehler M. Chikarmane V. Choudhury B. Cinnor F. Ege C. Ganpule C. Glassman T. Grover R. Hentges P. Hicks J. Jones D. Kandas A. Khan H. Lazo N. Lee K. S. Liu H. Madhavan A. McFadden R. Mule’ T. Parsons D. Parthangal P. Rangaraj S. Rao D. Roesler J. Schmitz A. Sharma M. Shin J. Shusterman Y. Speer N. Tiwari P. Wang G. Yashar P. Mistry K. , Conference Proceedings of the IEEE International Interconnect Technology (IITC) (2012).
2. Conversion of a plasma enhanced chemical vapor deposited silicon–carbon–nitride thin film at ultra-low temperature by oxygen plasma
3. Surface passivation ofn-type crystalline Si by plasma-enhanced-chemical-vapor-deposited amorphous SiCx:H and amorphous SiCxNy:H films
4. Time-Dependent Dielectric Breakdown Studies of PECVD H:SiCN and H:SiC Thin Films for Copper Metallization
5. Low-k dielectrics on base of silicon carbon nitride films
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献