Author:
Yun Changhan H.,Martin Jack,Chen L,Frey T. J.
Abstract
Various categories of bonding technologies were investigated for MEMS encapsulation applications. The bonding processes presented in this paper include Al to Al, Si to Si, and metal (Al or Au) to Si. Among the above different bonding schemes, the Al to Al bonding gave the highest process yield and bond strength. In addition, actual MEMS accelerometers were successfully integrated with Al to Al bonding with high yield all the way through plastic over-mold packaging and assembly.
Publisher
The Electrochemical Society
Cited by
14 articles.
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