Texture of Al films for wafer-level thermocompression bonding-Reference-Cited by-同舟云学术

Texture of Al films for wafer-level thermocompression bonding

Published:2017-06 Issue: Volume:106 Page:216-233
ISSN:0749-6036
Container-title:Superlattices and Microstructures
language:en
Short-container-title:Superlattices and Microstructures

Author:

Malik Nishant,Venkatachalapathy Vishnukanthan^ORCID,Dall Wilhelm^ORCID,Schjølberg-Henriksen Kari,Poppe Erik,Visser Taklo Maaike M.,Finstad Terje G.

Funder

The Research Council of Norway

MSENS

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference60 articles.

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5. Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold;Taklo;J. Micromech. Microeng.,2004

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