Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding-Reference-Cited by-同舟云学术

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Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding

Published:2017-02-20 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Silicon Photonics XII
language:
Short-container-title:

Author:

Schjølberg-Henriksen K.¹,Gjessing J.¹,Bakke K. A. H.¹,Hadzialic S.¹,Wang D. T.¹

Affiliation:

1. SINTEF (Norway)

Publisher

SPIE

Reference19 articles.

1. Overview and development trends in the field of MEMS packaging;Reichl,2001

2. Wafer-scale encapsluation: Controlling MEMS packaging costs (Review);Markunas,2002

3. Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications

4. Wafer level packaging of MEMS

5. InfiniTime: Multi-sensor wearable bracelet with human body harvesting;Magno,2016

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding;Japanese Journal of Applied Physics;2017-12-27

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