Alloying of a Less Noble Metal in Electrodeposited Cu Through Underpotential Deposition-Reference-Cited by-同舟云学术

Alloying of a Less Noble Metal in Electrodeposited Cu Through Underpotential Deposition

Published:1995-07-01 Issue:7 Volume:142 Page:2244-2249
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Horkans Jean¹²,Chang I‐Chia Hsu¹²,Andricacos P. C.¹²,Deligianni Hariklia¹²

Affiliation:

1. IBM Research Division, T.J. Watson Research Center, Yorktown Heights, New York 10598, USA

2. IBM Microelectronics Division, East Fishkill Facility, Hopewell Junction, New York 12533, USA

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2044281/pdf

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