(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization-Reference-Cited by-同舟云学术

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(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Published:2019-12-17 Issue:4 Volume:33 Page:3-16
ISSN:1938-6737
Container-title:ECS Transactions
language:
Short-container-title:ECS Trans.

Author:

Di Cioccio Lea,Gueguen P.,Taibi R.,Landru Didier,Gaudin G.,Chappaz C.,Rieutord François,De Crecy F.,Radu Ionut,Chapelon L.,Clavelier Laurent

Publisher

The Electrochemical Society

Link

https://iopscience.iop.org/article/10.1149/1.3483489/pdf

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Polymer Direct Bonding Characterization in Wafer Level Packaging for 3D Integration;2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2021-12-21

3. Effect of Annealing-Induced Tensions on the Mechanical Failure of Copper/Copper Interface in Wafer-to-Wafer Hybrid Bonding;ECS Journal of Solid State Science and Technology;2021-02-01

4. Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications;Microelectronic Engineering;2019-04

5. Toward Three-Dimensional High Density;3D Integration in VLSI Circuits;2018-04-17

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