The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding-Reference-Cited by-同舟云学术

The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Mirkarimi Laura¹,Uzoh Cyprian¹,Suwito Dominik¹,Lee Bongsub¹,Fountain Gill¹,Workman Thomas¹,Theil Jeremy¹,Gao Guilian¹,Buckalew Bryan²,Oberst Justin²,Ponnuswamy Thomas²

Affiliation:

1. Xperi Corporation,San Jose,CA,95134

2. Lam Research Corporation,Tualatin,OR,97062

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816643.pdf?arnumber=9816643

Reference13 articles.

1. Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

2. Recovery and Recrystallization: Phenomena, Physics, Models, Simulation

3. The Contribution of Grain-Boundary Diffusion to Creep at Low Stresses

4. A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials

5. A back-illuminated global-shutter CMOS image sensor with pixel-parallel 14-bit subthreshold;sakai;IEEE Int Solid-State Circuit Conf (ISSCC),2018

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