The Contribution of Grain-Boundary Diffusion to Creep at Low Stresses

Author:

Burton B.,Greenwood G. W.

Publisher

Informa UK Limited

Subject

General Engineering

Cited by 128 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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4. Primary creep at low stresses in copper;Materials Science and Engineering: A;2023-05

5. The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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