A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches-Reference-Cited by-同舟云学术

A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

Published:2001 Issue:12 Volume:148 Page:C767
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Josell D.,Wheeler D.,Huber W. H.,Bonevich J. E.,Moffat T. P.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Damascene copper electroplating for chip interconnections

2. J. Reid and S. Mayer, inAdvanced Metallization Conference 1999, p. 53, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Editors, MRS, Warrendale, PA (2000).

3. T. Ritzdorf, D. Fulton, and L. Chen, inAdvanced Metallization Conference 1999, p. 101, M. E. Gross. T. Gessner, N. Kobayashi, and Y. Yasuda, Editors, MRS, Warrendale, PA (2000).

4. E. Richard, I. Vervoort, S. H. Brongersma, H. Bender, G. Beyer, R. Palmans, S. Lagrange, and K. Maex, inAdvanced Metallization Conference 1999, p. 149, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Editors, MRS, Warrendale, PA (2000).

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