Author:
Sanada Toshiyuki,Hashimoto Kentaro,Hayashida Atsushi,Watanabe Masao
Abstract
In the LED manufacturing process, a thin Au film is deposited on a wafer, and then most of it is removed with small pieces of Au film left for electrodes. For this removal, we apply physical cleaning method, which can remove the metal film without chemicals. In this study, we investigate a removal process of a thin aluminum film deposited on a glass surface by steam-water mixed spray. At the initial stage of this process, tiny spots, whose sizes are the order of droplet diameter, are observed. And then very characteristic removal profiles, which are typically lines with sub-millimeter width, are observed. We discuss the removal mechanism due to high-speed droplet impact.
Publisher
The Electrochemical Society
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献