Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes-Reference-Cited by-同舟云学术

Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes

Published:2012 Issue:3 Volume:159 Page:H255-H259
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Jiao Yubo,Liao Xiaoyan,Wu Changhong,Theng Siannie,Zhuang Yun,Sampurno Yasa,Goldstein Michael,Philipossian Ara

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. http://blog.timesunion.com/capitol/archives/82186/cuomo-announces-intel-ibm-will-partner-at-nanocollege/.

2. http://semiconwest.org/node/6371.

3. http://www.semi.org/en/IndustrySegments/WaferProcessing/ssLINK/CTR_041227.

4. Watanabe M. Kramer S. , The Electrochemical Society Interface, pp. 28–31, winter (2006).

5. Technology Decisions to Minimize 450-mm Wafer Size Transition Risk

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